What is a PCB high frequency board

Abstract: PCB high frequency board is a special circuit board with high electromagnetic frequency. In general, high frequencies can be defined as frequencies above 1GHz. Its physical performance, precision and technical parameters are very high, and it is often used in automobile collision avoidance systems, satellite systems, radio systems and other fields. So, do you know the classification of FS PCB high frequency boards? How to choose pcb high frequency board? Let me see next

PCB high frequency board refers to a special circuit board with high electromagnetic frequency, which is used for high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter). Copper clad laminate (CCL) is a circuit board produced by some processes using ordinary rigid circuit board manufacturing methods or special processing methods. Generally speaking, a high frequency board can be defined as a circuit board with a frequency higher than 1GHz. The substrate material needs to have excellent electrical properties, good chemical stability, and as the frequency of the power supply signal increases, the loss on the substrate is very small, so high-frequency circuit boards are very important

What are the classifications of PCB high frequency circuit boards

1 Final ceramic filled thermoset

processing methods

The process is similar to epoxy glass weave (FR4), but the board is brittle, easy to break, drilled and gong board

2. The service life of drill bits and gong knives is reduced by 20%. PTFE (polytetrafluoroethylene) material

processing methods

1 Cutting: The protective film must be kept when cutting to prevent scratches and indentations

2. Drilling:

(1) Use a new drill bit (standard 130), preferably one, with a presser foot pressure of 40psi

(2) Use an aluminum plate as a cover plate, and then use a 1mm melamine back plate to tighten the Teflon plate

(3) After drilling, blow out the dust in the hole with an air gun

(4) Use the most stable drill bit, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the chip load, and the smaller the return speed)

3-hole treatment

Plasma treatment or sodium naphthalene activation treatment favors pore metallization

4 PTH copper precipitation

(1) After micro-etching (the micro-etching rate has been controlled at 20 micro inches), at PTH

(2) Pull the plate out of the cylinder. Does the second PTH pass as expected, if necessary? The cylinder starts to enter the plate

5 Solder mask

(1) Pretreatment: pickling, non-mechanical grinding

(2) After pretreatment, bake on the upper plate (90℃, 30min), brush green oil to cure

(3) The baking pan is divided into three stages: 80°C, 100°C, and 150°C, 30 minutes each time (if the surface of the substrate is found to be greasy, it can be reworked: wash off the green oil and reactivate)

6 copper plates

Spread the white paper on the circuit surface of the PTFE board, clamp it up and down with a 1.0mm thick FR-4 substrate or a 1.0mm thick phenolic substrate, and then remove the copper foil.

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